Slice Engineering Wärmeleitpaste - 5cc resin Core features

Core features

Material Operations System (MOS): Controls filament temperature and humidity for optimal printing conditions and automatic filament changes

Reliability: No nozzle clogging

Compatible with a variety of resin printers

Slice Engineering Wärmeleitpaste - 5cc resin Core featuresThe Slice Engineering boron nitride thermal paste improves heat conduction and acts as a release agent. Unlike anti seize compounds, boron nitride is not electrically conductive, eliminating the risk of a short circuit in your heating cartridge or thermistor. Highlights: Improved thermal conductivity Acts as a release agent Not electrically conductive Temperature resistant up to 850 C in air, 1800 C in vacuum Convenient 5 cc syringe with Luer lock